"Experiments have been conducted to investigate the effect of the interstitial materials at the interface of metals in contact. The test specimens were cylinders, axially aligned and loaded. Specimen materials were 606l-T6 aluminum alloy, and the contact fillers were stainless steel wire screens, aluminum foil, paper, and dielectric greases. The tests were conducted at atmospheric environment. The contact pressure ranged from 25 psi to 600 psi. The mean interface temperature ranged from 100 ºF to 200 ºF. Surface roughnesses of specimens were from 25 to 35 micro-inches, rms. The results of the investigation reveal that if the contact surfaces are sandwiched with interstitial material, the interface conductance is primarily dependent upon the thermal conductivity of this interstitial material. Some materials such as wire screen have the advantage of being less dependent upon temperature, pressure, and contact surface conditions, compared to bare junctions. The interstitial materials can either increase or decrease the contact resistance. In the case of aluminum foil sandwiched between the aluminum surfaces, the interface conductance increases three times, and sandwiched with greases, increases 10 times as much as that of the aluminum bare junction. On the other hand, if sandwiched with paper the interface conductance is lowered to 70 percent. This paper presents various characteristics of interstitial materials and provides some reliable data for engineering design purposes and further analysis in this field"--Abstract, page ii.
Remington, Charles R., 1924-2013
Sauer, Harry J., Jr., 1935-2008
Pagano, Sylvester J., 1924-2006
Mechanical and Aerospace Engineering
M.S. in Mechanical Engineering
University of Missouri--Rolla
vi, 47 pages
© 1970 Jin-Tyan Lin, All rights reserved.
Thesis - Open Access
Library of Congress Subject Headings
Extracellular matrix -- Thermal conductivity
Heat -- Conduction -- Measurement
Print OCLC #
Electronic OCLC #
Link to Catalog Record
Lin, Jin-Tyan, "Influence of some interstitial materials on the thermal contact conductance" (1970). Masters Theses. 7166.