Adhesion delamination mechanics of linear and axisymmetric film at film substrate interface
"This thesis is to characterize the thin membrane adhesion-delamination phenomena which occur in biological cells and micro-electro-mechanical systems (MEMS) operation. The delamination of a thin film adhered to a rigid substrate is subjected to the coupling effects of tensile residual stress and interfacial adhesion energy. The adhesion-delamination mechanics is derived using the classical linear elasticity and thermodynamics energy balance. The membrane deformation is here dominated by a mixed plate-bending and membrane-stretching, while the concomitant stress is neglected. An 1-dimensional model is first investigated where a pre-stressed rectangular film clamped at both ends delaminates from a rigid punch of the same dimension as the film width. Upon a tensile external load applied to the rigid punch, "Pinch-off", or stable shrinking of the contact area to a line prior to complete detachment, is predicted. The 1-dimensional model is further extended to a 2-dimensional axisymmetric geometry. A thin circular film clamped at the periphery detaches from the planar surface of a rigid cylindrical punch upon external load. "Pull-off", or spontaneous detachment from the substrate, occurs when the contact circle shrinks to between 0.1758 and 0.3651 times the film radius depending on the magnitude of the residual membrane stress. The finite "pulloff" radius differs from the 1-dimensional counterpart. The models are useful in understanding the behavior of various adhesion-delamination phenomena, such as capacitive MEMS-RF switches, micro pumps, microstructure network, and nanostructures"--Abstract, page iii.
Miller, Brad A.
Mechanical and Aerospace Engineering
M.S. in Mechanical Engineering
National Science Foundation (U.S.)
University of Missouri Research Board
University of Missouri--Rolla
x, 52 pages
© 2007 Ming-Fung Wong, All rights reserved.
Thesis - Open Access
Composite materials -- Delamination
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Link to Catalog Record
Wong, Ming-Fung, "Adhesion-delamination mechanics of linear and axisymmetric film at film-substrate interface" (2007). Masters Theses. 5293.