Via modeling and lossy media in the power bus structure of multilayer printed wiring boards
Electrical and Computer Engineering
M.S. in Electrical Engineering
University of Missouri--Rolla
xi, 77 pages
© 1994 Michael John Wilhelm, All rights reserved.
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Full-text not available: Request this publication directly from Missouri S&T Library or contact your local library.http://merlin.lib.umsystem.edu/record=b2565137~S5
Wilhelm, Michael J., "Via modeling and lossy media in the power bus structure of multilayer printed wiring boards" (1994). Masters Theses. 1354.
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