Large Scale Signal and Interconnect FDTD Modeling for BGA Package

Xiaohe Chen
James L. Drewniak, Missouri University of Science and Technology
Jianmin Zhang
Bruce Archambeault, Missouri University of Science and Technology
Michael A. Cracraft
Samuel Connor

This document has been relocated to

There were 37 downloads as of 27 Jun 2016.


This paper introduces a finite-difference time-domain (FDTD) approach to modeling portions of ball grid array (BGA) package interconnect circuits. A full wave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements