ESD Field Coupling Study in Relation with PCB GND and Metal Chassis

Jong-Sung Lee
David Pommerenke, Missouri University of Science and Technology
Jae-Deok Lim
Byong-Su Seol

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This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.