Radiation Mechanisms for Semiconductor Devices and Packages

Todd H. Hubing, Missouri University of Science and Technology
Daryl G. Beetner, Missouri University of Science and Technology
Shaowei Deng
Xiaopeng Dong

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1848

There were 5 downloads as of 28 Jun 2016.


VLSI semiconductor devices are often the source of radiated electromagnetic emissions from electronic devices. Noise coupled from these devices to resonant structures on the printed circuit board, resonant cables or resonant enclosures can result in EMI problems that are difficult or expensive to solve at the board or system level. This paper reviews three mechanisms by which noise can be coupled from semiconductor devices and packages resulting in radiated electromagnetic emissions.