Via Coupling Within Power-Return Plane Structures Considering the Radiation Loss

J. Chen
Todd H. Hubing, Missouri University of Science and Technology
Weimin Shi
R. L. Chen

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An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.