Eliminating Via-Plane Coupling using Ground Vias for High-Speed Signal Transitions

Songping Wu
Xin Chang
Christian Schuster
Xiaoxiong Gu
Jun Fan, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1003

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When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.