Application of Chip-Level EMC in Automotive Product Design

H. Weng
Daryl G. Beetner, Missouri University of Science and Technology
David Pommerenke, Missouri University of Science and Technology
James L. Drewniak, Missouri University of Science and Technology
K. Lavery
Jason Whiles
Kuifeng Hu

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Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O power in this application reduced emissions by 10 dB or more at critical frequencies. Possible causes for emissions from the IC and modifications that might reduce these emissions are discussed.