Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB
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Abstract
Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.
