Lumped-Element Sections for Modeling Coupling Between High-Speed Digital and I/O Lines

Hao Shi
Xiao Luo
Fei Sha
James L. Drewniak, Missouri University of Science and Technology
T. Anderson
Thomas Van Doren, Missouri University of Science and Technology
Wei Cui

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1110

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Abstract

Lumped-element sections are used for modeling coupling between high-speed digital and I/O lines on printed circuit boards (PCBs) in this paper. Radiated electromagnetic interference (EMI) is investigated when the I/O line going off the board is driven as an unintentional, but effective antenna. Simulated results are compared with measurements for coupled lines. A suitable number of lumped-element sections for modeling is chosen based on the line length and the highest frequency of interest.