Development and Validation of a Microcontroller Model for EMC

Shaohua Li
Jason Whiles
Pius Ng
Haixiao Weng
David Pommerenke, Missouri University of Science and Technology
Daryl G. Beetner, Missouri University of Science and Technology
Hemant Bishnoi

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Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board development and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a PCB. The IC and package model was generated using the Apache tool suite. A model of the PCB was created using an electromagnetic cavity model and lumped-element models of components on the board. Values of predicted and measured impedance looking into the IC and PCB matched within a few dB from a few 10s of MHz up to 1 GHz. Measured and predicted values of noise voltage matched within about 6 dB at clock harmonics up to 600-700 MHz.