Effects of Open Stubs Associated with Plated Through-Hole Vias in Backpanel Designs

Todd H. Hubing, Missouri University of Science and Technology
James L. Drewniak, Missouri University of Science and Technology
Ray Alexander
James L. Knighten
Norman W. Smith
Shaowei Deng
Jingkun Mao
Jun Fan, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/999

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Abstract

Plated through-hole (PTH) vias are commonly used in printed circuit boards. They usually leave open stubs if the signal(s) does not transition the entire depth of the board. These open stubs can have a negative impact on signal transmission. This summary reports the investigation of the impact of the open via stubs in a typical backpanel design.