FDTD and FEM/MOM Modeling of EMI Resulting from a Trace Near a PCB Edge

Motoshi Tanaka
Yun Ji
Xiaoning Ye
James L. Drewniak, Missouri University of Science and Technology
Todd H. Hubing, Missouri University of Science and Technology
Richard E. DuBroff, Missouri University of Science and Technology
Thomas Van Doren, Missouri University of Science and Technology
Daniel P. Berg

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1628

There were 4 downloads as of 28 Jun 2016.

Abstract

PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.