SPICE Model Libraries for Via Transitions

Shaofeng Luan
Giuseppe Selli
Mauro Lai
Ray Alexander
G. Antonini
A. Ciccomancini
Antonio Orlandi
James L. Drewniak, Missouri University of Science and Technology
James L. Knighten
Norman W. Smith
Jun Fan, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1889

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A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.