Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design

Minjia Xu
Todd H. Hubing, Missouri University of Science and Technology
J. Chen
Thomas Van Doren, Missouri University of Science and Technology
James L. Drewniak, Missouri University of Science and Technology
Richard E. DuBroff, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1217

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Abstract

This paper experimentally investigates the effectiveness of embedded capacitance for reducing power-bus noise in high-speed printed circuit board designs. Boards with embedded capacitance employ closely spaced power-return plane pairs separated by a thin layer of dielectric material. In this paper, test boards with four embedded capacitance materials are evaluated. Power-bus input impedance measurements and power-bus noise measurements are presented for boards with various dimensions and layer stack ups. Unlike discrete decoupling capacitors, whose effective frequency range is generally limited to a few hundred megahertz due to interconnect inductance, embedded capacitance was found to efficiently reduce power-bus noise over the entire frequency range evaluated (up to 5 GHz).