Link Path Design on a Block-by-Block Basis

Francesco de Paulis
Jun Fan, Missouri University of Science and Technology
Jay Diepenbrock
Samuel Connor
Antonio Orlandi
Bruce Archambeault, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1703

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Abstract

In high-speed data communication systems, the complexity of link path between transmitters and receivers present a challenge for designers to maintain an acceptable bit error rate. An approach is presented in this paper to design the link path on a block-by-block basis. The unique advantage of this approach lies on the physics-based model of each block, which relates performance to geometry and makes design improvement and optimization possible. An example link path involving a backpanel is investigated using the approach. The via stubs and the dielectric materials in the backpanel are demonstrated to be critical factors for link performance in certain situations.