DC power-bus modeling in high-speed digital design using the FDTD method is reported here. The dispersive medium is approximated by a Debye model to account for the loss. A wide band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Favorable agreement is achieved between the modeled and measured results for a typical DC power-bus structure with multiple SMT decoupling capacitors mounted on the board. The FDTD tool is then applied to investigate the effects of local decoupling on a DC power-bus. The modeled results agree with the results from another modeling tool, the CEMPIE (a circuit extraction approach based on a mixed-potential integral equation formulation) method.

Meeting Name

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (2000: Oct. 23-25, Scottsdale, AZ)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Approximation Theory; Capacitors; Computer Simulation; Finite Difference Method; Multilayers; Semiconductor Device Models; Surface Mount Technology; Time Domain Analysis; Debye Models; Direct Current Power Bus Designs; Printed Circuit Boards; Finite Difference Methods; Dispersion; Capacitors; Noise Reduction; Resonant Frequency; Testing; Coaxial Cables; Electromagnetic Compatibility; Integral Equations; Finite Difference Time-Domain Analysis; Dispersive Media; Frequency Response; Printed Circuit Design; Power Supply Circuits; Digital Circuits

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2000