A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

3D Full-Wave Modeling; EMI; FDTD; MTL Models; Automobiles; Automotive EMC; Automotive Electronics; Automotive Harness; Automotive Platforms; Cable Bundle; Cables (Electric); Car Body; Commercial Vehicles; Common-Mode Discontinuities; Current Distribution; Electromagnetic Compatibility; Electromagnetic Interference; Electronic Modules; Finite Difference Time-Domain Analysis; Impressed Current Sources; Multi-Wire Subcellular Algorithm; Multiconductor Transmission Lines; Multiconductor Transmission-Line Models; On-Board Interference; Radiation Impedance; Transmission Line Theory; Common-Mode current; FDTD Multi-Wire Subcellular Algorithm; Multi-Conductor Transmission Line (MTL)

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2004