The power distribution network in a printed circuit board (PCB) inside a compact-size enclosure is an effective path for high-speed digital noise to be coupled to the RF receivers inside the same enclosure, causing RF interference (RFI) issues. This noise coupling mechanism from PCB to shielding enclosure is investigated in this paper using the cavity model and the segmentation technique. In this approach, the structure of an enclosure with a PCB inside is divided into cavities with both horizontal and vertical connections. Modeling result agrees well with full wave simulations, and the simulation time is considerably reduced. Furthermore, the relationship among the noise coupling, the PCB-related resonances, and the enclosure-related resonances is studied as well.
Z. Yu et al., "Analysis of Noise Coupling from Printed Circuit Board to Shielding Enclosure," Proceedings of the Electrical Performance of Electronic Packaging, 2008. IEEE-EPEP, Institute of Electrical and Electronics Engineers (IEEE), Oct 2008.
The definitive version is available at https://doi.org/10.1109/EPEP.2008.4675902
Electrical Performance of Electronic Packaging, 2008. IEEE-EPEP
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic Shielding; Interference; Couplings; Printed circuits; Radio - Receivers and reception; Radio frequency
Article - Conference proceedings
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Oct 2008