Investigation of a dc power delivery network, consisting of a multilayer PCB using area fills for power and return, involves the distributed behavior of the power/ground planes and the parasitics associated with the lumped components mounted on it. Full-wave methods are often employed to study the power integrity problem. While full-wave methods can be accurate, they are time and memory consuming. The cavity model of a rectangular structure has previously been employed to efficiently analyze the simultaneous switching noise (SSN) in the power distribution network. However, a large number of modes in the cavity model are needed to accurately simulate the impedance associated with the vias, leading to computational inefficiency. A fast approach is detailed herein to accelerate calculation of the summation associated with the higher-order modes. Closed-form expressions for the parasitics associated with the interconnects of the decoupling capacitors are also introduced. Combining the fast calculation of the cavity models of regularly shaped planar circuits, a segmentation method, and closed-form expressions for the parasitics, an efficient approach is proposed herein to analyze an arbitrary shaped power distribution network. While it may take many hours for a full-wave method to do a single simulation, the proposed method can generally perform the simulation with good accuracy in several minutes. Another advantage of the proposed method is that a SPICE equivalent circuit of the power distribution network can be derived. This allows both frequency and transient responses to be done with SPICE simulation.


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Resonators; Computer Aided Network Analysis; Electric Power Supplies To Apparatus; Inductance Measurement; Printed Circuit Boards; Spurious Signal Noise, Circuit Modeling; Parasitic Interconnect Inductances; Power Distribution; Simultaneous Switching Noise; Electronics Packaging; Inductance

International Standard Serial Number (ISSN)

1521-3323; 1557-9980

Document Type

Article - Journal

Document Version

Final Version

File Type





© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 May 2006