Abstract
In this letter, a counter-doped junction termination extension (CD-JTE) structure was experimentally implemented and studied. Two groups of 4H-SiC PiN diodes were fabricated with two n-type drift layer thicknesses of 11 and 30 \mu \text{m}, respectively, and with different termination structures, in order to demonstrate the wide JTE dose tolerance of CD-JTE. Three different doses, 1.7 \times 10^{13}, 2.2\times 10^{13} , and 2.8\times 10^{13} cm ^{-2} , were used for the critical JTE implantation. The measured breakdown voltages (BVs) of the diodes with all termination structures and JTE doses were compared with simulation predictions. Electroluminescence at the BV was recorded and used to locate the peak electrical field. The test results matched well with the simulation results. As a result of the effectiveness and robustness of the CD-JTE, the best achieved BVs from the diodes on the 11- and 30- \mu \text{m} epilayers were 1850 and 4800 V, respectively.
Recommended Citation
J. Y. Jiang et al., "Experimental Study of Counter-Doped Junction Termination Extension for 4H-SiC Power Devices," IEEE Electron Device Letters, vol. 36, no. 7, pp. 699 - 701, article no. 7098328, Institute of Electrical and Electronics Engineers, Jul 2015.
The definitive version is available at https://doi.org/10.1109/LED.2015.2428617
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
4H-SiC; breakdown voltage; counter-doped; junction termination extension
International Standard Serial Number (ISSN)
0741-3106
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2025 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jul 2015
