Abstract
A method to model, measure, and characterize a high-transient current in an electrical packaging solution is described herein. These methods help overcome the challenge of generating model to hardware correlation in high current applications. A specialized test platform is developed and used to characterize current density in test hardware. The measurements are used to characterize a custom power distribution network and verify validity of current density predictions. This data is critical in high-current applications for finding and measuring current density through plane pinch points that can cause early failures in the field due to electromigration and delamination.
Recommended Citation
M. Doyle et al., "Package Power Distribution Current Density in Applications with Large Transient Currents," Proceedings - Electronic Components and Technology Conference, pp. 1312 - 1316, Institute of Electrical and Electronics Engineers, Jan 2021.
The definitive version is available at https://doi.org/10.1109/ECTC32696.2021.00212
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-073814523-5
International Standard Serial Number (ISSN)
0569-5503
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2021
Comments
Mayo Clinic, Grant None