Abstract
Far-end crosstalk (FEXT) between adjacent signal lines is one of the most critical factors affecting signal integrity (SI) in double data rate 5 (DDR5) printed circuit boards (PCBs). In this paper, a new method for FEXT reduction, based on mushroom structures thickened solder mask (MSTS) for coupled signal lines, is proposed and investigated. From the simulated S-parameters results, FEXT of this proposed method can be suppressed among a very wide frequency range. Additionally, the FEXT is decreased more than 25dB around the main frequency of DDR5, compared with the traditional signal routing. Finally, both frequency and time domains results show that our proposed method could significantly improve the performance of SI and dramatically reduce FEXT for DDR5 system designs.
Recommended Citation
X. B. Yu et al., "FEXT Reduction using Mushroom Structures Thickened Soldermask for DDR5 PCBs," 2020 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2020 - Proceedings, article no. 9245950, Institute of Electrical and Electronics Engineers, Aug 2020.
The definitive version is available at https://doi.org/10.1109/APCAP50217.2020.9245950
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
DDR5; Far-end crosstalk (FEXT); mushroom structures thickened soldermask (MSTS); reduction; SI
International Standard Book Number (ISBN)
978-172819805-7
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
04 Aug 2020
Comments
Intel Corporation, Grant 19zx7156