Erratum: Measurement Methodologies for Acoustic Noise Induced by Multilayer Ceramic Capacitors of Power Distribution Network in Mobile Systems (IEEE Trans. Electromagn Compat. (2020) 62:4 (1515–1523) DOI: 10.1109/TEMC.2020.2993850)

Abstract

In [1], reference [2] is missing. It should be added after citation "[10]"in Section I, paragraph 3: "MLCCs as decoupling capacitors for PDN design to improve power integrity and mobile device functionality has been investigated extensively [1], [6]. However, only focus on the electrical performance of PDN is not enough to ensure customer experience. The acoustic noise problem related to PDN should also be addressed properly. The correlation between the acoustic noise, MLCC/PCB vibration are studied [7]. However, the measurement is carried out on a simple test vehicle with limited number of MLCCs. Moreover, the relationship between PDN electrical noise and the acoustic noise is not explicitly revealed for real practical product. A SSD product is investigated for the acoustic noise issue [8] based on the modal analysis. However, the noisy capacitors are not identified. Also, the power rail noise is not inspected during the SSD product operation. Baek [9] proposed a method to debug the MLCCs based on the AC droop level on the MLCC. Nonetheless, considering the MLCC manufacturing/material variation and the very close voltage level of MLCCs on the same power rail at the audible frequency range, the electrical signal to MLCC vibration transfer may vary significantly [4], it is better to bring in vibration for coanalysis. To reduce acoustic noise, identifying the problematic MLCCs is preferable as hundreds of decoupling capacitors are attached to different power rails of the entire PDN. The modal analysis of PCB is also crucial as the intrinsic vibration properties of board determine how the board vibrates under the influence of MLCC vibration [10]. With pinpointed MLCCs, proper mitigation method can be applied to save debugging time and solution cost.

Department(s)

Electrical and Computer Engineering

Comments

National Science Foundation, Grant IIP-1916535

International Standard Serial Number (ISSN)

1558-187X; 0018-9375

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

01 Apr 2021

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