Abstract
Integrated circuits suffer from interference in frequency multibands in real scenarios, and this susceptibility allows them to easily malfunction. In this article, a novel miniature coplanar filter in package to enhance the immunity of integrated circuits is proposed. The coplanar structure of the filter can avoid cost issues of the multilayers and can also be implemented in the substrate or interposer of the package, and also in a flexible/foldable board, with normal board, fabrication process. Analysis of the filtering characteristics and design method of a miniature filter with the required stop bands are demonstrated in detail. The designed band-stop filter can deteriorate noises in the required frequency bands, thus enhancing the immunity of integrated circuits. The immunity enhancement is validated with standard direct power injection measurements for the designed chip with or without our designed filter in package. The proposed methodology could be useful as a design guide to improve the immunity of integrated circuits without costly on-chip area and process.
Recommended Citation
B. Pu et al., "Immunity Enhancement of the Power Distribution Network in Integrated Circuits with Coplanar Meander Lines in Package," IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 2238 - 2246, article no. 8959385, Institute of Electrical and Electronics Engineers, Oct 2020.
The definitive version is available at https://doi.org/10.1109/TEMC.2019.2962096
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Band-stop filter; coplanar meander lines; immunity; integrated circuits (ICs); interposer; package; power distribution network (PDN)
International Standard Serial Number (ISSN)
1558-187X; 0018-9375
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Oct 2020
