Abstract
The piezoelectric effect will cause the multilayer ceramic capacitor (MLCC) to deform in several directions. When it is soldered to the printed circuit board (PCB) and powered on, these deformations will exert a certain force on the PCB, causing the PCB to vibrate and emit acoustic noise at a certain frequency. Determining the dominant deformation direction that MLCC can affect the PCB is relevant and important for efficiently extracting the equivalent source of noise. This paper provides a method to determine the dominant deformation direction produced by MLCC, explores it through experimental measurement results, and finally provides a conclusion to the investigation.
Recommended Citation
Y. Ding et al., "Experimental Study of PCB Vibration Induced by MLCC Assembly Orientation and Process Variations," IEEE International Symposium on Electromagnetic Compatibility, pp. 110 - 113, Institute of Electrical and Electronics Engineers, Jan 2024.
The definitive version is available at https://doi.org/10.1109/EMCSIPI49824.2024.10705552
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
deformation; equivalent source; Multilayer ceramic capacitor (MLCC); piezoelectric characteristic; power noise; vibration velocity
International Standard Serial Number (ISSN)
2158-1118; 1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2024
Comments
National Science Foundation, Grant IIP-1916535