Abstract

Printed circuit board dielectric substrates are composite materials produced by embedding fiber glass fabrics into epoxy resin. Because of this the medium in the PCB transmission lines is inhomogeneous which often leads to degradation of the signal integrity performance of the lines, particularly due to the differential skew. The detrimental effect of the fiber weave can be modeled relatively accurately using full-wave analysis, but at a high computational cost. Alternative modelling techniques are less demanding but often lack accuracy. This article investigates a possibility of using the 2D cross-sectional analysis for the fiber weave effect modeling, which considerably decreases the computational cost of modeling while retaining the accuracy inherent to the field solvers.

Department(s)

Electrical and Computer Engineering

Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases

2D cross-sectional analysis; PCB; weave effect

International Standard Serial Number (ISSN)

2158-1118; 1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

01 Jan 2024

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