Abstract
Printed circuit board dielectric substrates are composite materials produced by embedding fiber glass fabrics into epoxy resin. Because of this the medium in the PCB transmission lines is inhomogeneous which often leads to degradation of the signal integrity performance of the lines, particularly due to the differential skew. The detrimental effect of the fiber weave can be modeled relatively accurately using full-wave analysis, but at a high computational cost. Alternative modelling techniques are less demanding but often lack accuracy. This article investigates a possibility of using the 2D cross-sectional analysis for the fiber weave effect modeling, which considerably decreases the computational cost of modeling while retaining the accuracy inherent to the field solvers.
Recommended Citation
V. Khilkevich and S. Hinaga, "Modelling Weave Effect in PCBs using 2D Cross-sectional Analysis," IEEE International Symposium on Electromagnetic Compatibility, pp. 330 - 335, Institute of Electrical and Electronics Engineers, Jan 2024.
The definitive version is available at https://doi.org/10.1109/EMCSIPI49824.2024.10705435
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
2D cross-sectional analysis; PCB; weave effect
International Standard Serial Number (ISSN)
2158-1118; 1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2024
Comments
National Science Foundation, Grant IIP-1916535