Radio-Frequency Interference Estimation for Multiple Random Noise Sources


As more compact designs and more assembled function modules are utilized in modern electronic devices, radio-frequency interference (RFI) source reconstruction is becoming more challenging because different noise sources may contribute simultaneously. This article presents a novel methodology to reconstruct multiple random noise sources on a real-world product, including several double-data-rate (DDR) memory modules and a high-speed connector. The DDR modules located beneath a heatsink cause random noise-like signals, which renders phase measurements challenging. An approach based on the tuned-receiver mode of a vector network analyzer is developed to measure the field phase from the random DDR signals, which can be further modeled with a Huygens' box using the measured field magnitude and phase. Moreover, the connector can be modeled using an equivalent magnetic dipole. Furthermore, the total RFI power from the DDR memory modules and the high-speed connector, which generate uncorrelated RFI noise, is found to equal the summation of the individual power values obtained by an root mean square detector, which can be mathematically corroborated. Using the proposed method, the reconstructed source model can predict RFI values close to measurement results with less than 5 dB deviation.


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Publication Status

Early Access


This work was supported by the National Science Foundation under Grant IIP-1916535.

Keywords and Phrases

Connectors; Double-Data-Rate (DDR); Heating Systems; Huygens' Box; Integrated Circuit Modeling; Magnetic Dipole; Memory Modules; Multiple Sources; Noise Measurement; Phase Measurement; Radio-Frequency Interference (RFI); Radiofrequency Interference; Source Reconstruction; Uncorrelated Sources

International Standard Serial Number (ISSN)

1558-187X; 0018-9375

Document Type

Article - Journal

Document Version


File Type





© 2021 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

15 Nov 2021