Modeling of Power Supply Noise Associated with Package Parasitics in an On-Chip LDO Regulator
Abstract
In this paper, the power supply noise associated with package parasitics in an on-chip low-dropout (LDO) regulator is investigated. The on-chip LDO regulator with off-chip decoupling capacitors has power supply rail noise typically in the frequency range of few hundreds of MHz, which is related to the inductive package interconnects and the parasitic capacitance of the pass transistor. An equivalent circuit is proposed to model the power supply noise and understand the effect of inductive package interconnects. Based on the proposed equivalent circuit, the mitigation of the power supply noise from a package design perspective is discussed.
Recommended Citation
J. Joo et al., "Modeling of Power Supply Noise Associated with Package Parasitics in an On-Chip LDO Regulator," Proceedings of the 2021 Joint IEEE International Symposium on EMC/SI/PI, and EMC Europe (2021, Raleigh, NC), pp. 395 - 399, Institute of Electrical and Electronics Engineers (IEEE), Aug 2021.
The definitive version is available at https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559151
Meeting Name
2021 IEEE International Joint Electromagnetic Compatibility Signal and Power Integrity and EMC Europe Symposium, EMC/SI/PI/EMC Europe 2021 (2021: Jul. 26-Aug. 13, Raleigh, NC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Inductive Interconnects; LDO Regulator; Power Distribution Network (PDN) Design; Power Supply Noise
International Standard Book Number (ISBN)
978-166544888-8
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2021 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
13 Aug 2021
Comments
This work was supported in part by the National Science Foundation (NSF) under Grant IIP-1916535.