Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Abstract

An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.

Meeting Name

2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI 2020 (2020: Jul. 27-31, Virtual)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Electrostatic Discharge; Soft-Failure; USB IC Susceptibility

International Standard Book Number (ISBN)

978-172817430-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

10 Sep 2020

Link to Full Text

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