Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis
An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.
R. Hua et al., "Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis," Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, pp. 200-204, Institute of Electrical and Electronics Engineers (IEEE), Sep 2020.
The definitive version is available at https://doi.org/10.1109/EMCSI38923.2020.9191592
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI 2020 (2020: Jul. 27-31, Virtual)
Electrical and Computer Engineering
Keywords and Phrases
Electrostatic Discharge; Soft-Failure; USB IC Susceptibility
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
10 Sep 2020