Ground Bridge Effect on Reduction of Conducted Emission from Three-Phase Motor Drive System


In electric vehicles, the pulse width modulation scheme is widely used in three-phase motor drive systems for its high performance. However, the fast switching of semiconductor devices may induce excessively high dv/dt and di/dt, which can cause electromagnetic interference (EMI) issues, making it difficult to satisfy electromagnetic compatibility standards. In this paper, the current conducted emission test for a three-phase motor drive system is performed based on CISPR 25 component-level testing setup for AM radio frequency band, which is from 530 kHz to 1.8 MHz. Under these conditions, common-mode (CM) noise generation mechanisms of the motor drive system are identified through measurements. It is found that the dominant mechanism is the mode conversion from differential mode (DM) switching current of the three-phase PWM inverter to CM current through the cable harness due to the imbalances in the PCB structure and EMI filter network which are at the dc input side of the three-phase inverter. Based on this finding, ground (GND) bridges are added between the digital signal and power GND nets to reduce the CM noise. The GND bridge effect on the reduction of CM noise in AM band is experimentally verified and further studied using circuit simulations.

Meeting Name

2019 International Symposium on Electromagnetic Compatibility, EMC Europe 2019 (2019: Sep. 2-6, Barcelona, Spain)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory


This work was partly supported by the NSF No. IIP-1440110 and MANDO Co., Ltd., Seongnam-si, South Korea.

Keywords and Phrases

CISPR 25; Conducted Emission; Electromagnetic Compatibility; Electromagnetic Interference; Mode Conversion; Three-Phase Inverter; Three-Phase Motor

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

06 Sep 2019