Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System
Abstract
In this paper, we propose and analyze an double-eight shielding coil for a solenoid coil in loosely-coupled wireless power transfer (WPT) system. We suggest the shielding coil to get lower level of electromagnetic field (EMF) for the solenoid coil. The proposed double-eight shaped shielding coil, which are placed beside a transmitter (Tx) coil. The shielding coil is used to confine the leakage magnetic flux from the Tx coil and reduce the EMF. Furthermore, in the WPT system with the shielding coil, the equation of the resonant frequency condition is derived from the equivalent circuit. Using the proposed shielding coil, we reduced the EMF level by 9.3 dB scale.
Recommended Citation
B. Sim et al., "Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System," Proceedings of the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2019, New Orleans, LA), pp. 639 - 643, Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/ISEMC.2019.8825231
Meeting Name
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic Compatibility (EMC); Electromagnetic Field (EMF); Magnetic Field; Resonant Frequency; Solenoid Coil; Wireless Power Transfer
International Standard Book Number (ISBN)
978-153869199-1
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
26 Jul 2019
Comments
This research was supported by Basic Science Research Program through the funded by the Ministry of SMEs and Startups (S2604684). This research was supported by the MSIT (Ministry of Science and ICT), Korea, under the ITRC (Information Technology Research Center) support program (IITP-2019-2016-0-00291) supervised by the IITP (Institute for Information & communications Technology Planning & Evaluation). This research was supported by “Development of Interconnection System and Process for Flexible Three Dimensional Heterogeneous Devices†funded by MOTIE (Ministry of Trade, Industry and Energy) in Korea.