A Dual Resonance Near Field Communication Coil for EMF Reduction in Near Field Communication and Wireless Power Transfer Dual Coil System


Current wireless power transfer (WPT) technology is widely used for various applications because of convenience and safety. One of the typical application of the WPT system is the near-field communication (NFC) system utilized mobile WPT system. However, WPT systems have problems with electromagnetic field (EMF) leakage which can cause electromagnetic interference (EMI) issues on the nearby electrical devices. In this paper, we propose the dual resonance NFC coil for EMF reduction. Proposed dual resonance coil generates resonance not only at the NFC operating frequency of 13.56 MHz but also at the wireless charging frequency 130 kHz. When comparing the proposed NFC coil with a typical NFC antenna, the total EMF level of the WPT system is reduced by 3.96 dB at 130 kHz without any effect at the NFC operating frequency of 13.56 MHz.

Meeting Name

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory


This research was supported by the MSIT(Ministry of Science and ICT), Korea, under the ITRC (Information Technology Research Center) support program (IITP-2019-2016-0-00291) supervised by the IITP (Institute for Information & communications Technology Planning & Evaluation). This research was supported by “Development of Interconnection System and Process for Flexible Three Dimensional Heterogeneous Devices” funded by MOTIE (Ministry of Trade, Industry and Energy) in Korea.

Keywords and Phrases

3D Cellular Phones; Coils; Eddy Currents; Electromagnetic Field; Inductive Charging; Inductive Power Transmission; Magnetic Field; Near Field Communication; Wireless Power Transfer

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


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© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

26 Jul 2019