Reductions in Power Noise and System Area Burden using Wireless Power Transfer Scheme in 3D Package
Design challenges in 3D packages, which represent a system bandwidth of Tera Byte/sec, include serious SSN and large system area burden. For overcoming such design challenges, a package-level WPT scheme is proposed. Also, a proper inductor structure for 3D packages is proposed and verified through measuring the power efficiency of the WPT scheme according to inductor types. The WPT scheme in 3D packages that uses magnetic field resonance shows a noise filtering characteristic that significantly reduces power noise. In addition, the WPT system can reduce system area burden, as we can get rid of power interconnections, such as power balls and power TSVs, in 3D package/ICs based on its WPT scheme.
E. Song et al., "Reductions in Power Noise and System Area Burden using Wireless Power Transfer Scheme in 3D Package," Proceedings of the 2014 IEEE Wireless Power Transfer Conference (2014, South Korea), pp. 178-181, IEEE Computer Society, May 2014.
The definitive version is available at https://doi.org/10.1109/WPT.2014.6839576
2014 IEEE Wireless Power Transfer Conference, IEEE WPTC 2014 (2014: May 8-9, Jeju, South Korea)
Electrical and Computer Engineering
Keywords and Phrases
3D Package; Inductor Design; Magnetic Field Resonance; Power Efficiency; Power Noise; System Area Burden; Wireless Power Transfer
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2014 IEEE Computer Society, All rights reserved.
09 May 2014