Reductions in Power Noise and System Area Burden using Wireless Power Transfer Scheme in 3D Package

Abstract

Design challenges in 3D packages, which represent a system bandwidth of Tera Byte/sec, include serious SSN and large system area burden. For overcoming such design challenges, a package-level WPT scheme is proposed. Also, a proper inductor structure for 3D packages is proposed and verified through measuring the power efficiency of the WPT scheme according to inductor types. The WPT scheme in 3D packages that uses magnetic field resonance shows a noise filtering characteristic that significantly reduces power noise. In addition, the WPT system can reduce system area burden, as we can get rid of power interconnections, such as power balls and power TSVs, in 3D package/ICs based on its WPT scheme.

Meeting Name

2014 IEEE Wireless Power Transfer Conference, IEEE WPTC 2014 (2014: May 8-9, Jeju, South Korea)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

3D Package; Inductor Design; Magnetic Field Resonance; Power Efficiency; Power Noise; System Area Burden; Wireless Power Transfer

International Standard Book Number (ISBN)

978-147992923-8

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 IEEE Computer Society, All rights reserved.

Publication Date

09 May 2014

Link to Full Text

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