Wireless Power Distribution Network for 3D Package using Magnetic Field Resonance


In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mmx35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z11) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.

Meeting Name

6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 (2013: Dec. 12-15, Nara, Japan)


Electrical and Computer Engineering

Keywords and Phrases

3D Package; Inductor Design; Magnetic Field; PDN-Impedance; Power Distribution Network (PDN); Power Efficiency; Resonance; Simultaneous Switching Noise (SSN); Wireless Power Transfer (WPT)

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


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© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

15 Dec 2013