Title

Electromagnetic Interference Shielding Effects in Wireless Power Transfer using Magnetic Resonance Coupling for Board-To-Board Level Interconnection

Abstract

In this paper, we present the analysis of electromagnetic interference (EMI) shielding effects of wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists of source coil, receiver coil, and load which are manufactured on printed circuit board (PCB). The coil is expressed as a simple equivalent circuit model, of which the components are calculated using the physical dimensions of the coil. It is verified that the results of model estimation in both frequency-and time-domain show a good correlation with simulated and measured results under 1GHz. Voltage transfer ratio (VTR) of board-to-board WPT was achieved to be 0.49. In addition, EMI shielding effects in WPT with materials such as ferrite and metal film is analyzed using verified model. The shielding effects of each film in WPT are compared by observing their magnetic field distribution.

Meeting Name

2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013 (2013: Aug. 5-9, Denver, CO)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Electromagnetic Interference Shielding; Magnetic Field Distribution; Magnetic Resonance Couplings; Printed Circuit Boards (PCB); Simple Equivalent Circuit Model; Voltage Transfer Ratio (VTR); Wireless Power Transfer; Wireless Power Transfer (WPT), Computer Simulation; Electromagnetic Compatibility; Electromagnetic Pulse; Electromagnetic Wave Interference; Frequency Estimation; Magnetic Resonance; Shielding; Signal Interference, Printed Circuit Boards

International Standard Book Number (ISBN)

978-147990408-2

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

09 Aug 2013

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