Study of TDR Impedance for Better Analysis to Measurement Correlation
SI engineers usually build PCB test coupons and perform cross-sectioning and material properties extraction, and then do design optimization. But designing transmission lines on PCB with good analysis to measurement correlation is really challenging. Although there are some systematic approaches which can be applied to a broad range of applications for highspeed digital designs, it is found that in the validation process, there is always several-ohm mismatch in the comparison of TDR impedance between simulated and measurement results. This degrades engineers' confidence about high-speed design. Taking a real case as an example, this paper is trying to analyze which factors have influence on the trace impedance correlation and showing step by step how the agreement can be improved.
Y. Guo et al., "Study of TDR Impedance for Better Analysis to Measurement Correlation," Proceedings of the 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (2019, Sapporo, Japan), pp. 88-91, Institute of Electrical and Electronics Engineers (IEEE), Jun 2019.
The definitive version is available at https://doi.org/10.23919/EMCTokyo.2019.8893833
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019 (2019:Jun. 3-7, Sapporo, Japan)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Analysis to Measurement Correlation; Cross-Section; Etch Factor; Resin Pocket; Surface Roughness; TDR Impedance; Transmission Line
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2019 The Institute of Electronics, Information and Communication Engineer, All rights reserved.
01 Jun 2019