Title

Generic Modeling of Via-Stripline Structures in Multi-Layer Board for High Speed Applications

Abstract

To accelerate the simulation timing for more general structures like a stripline connected between vias, generic models were developed for a differential strip line connecting differential pair of vias. While a less time consuming 2-dimensional (2D) simulations are used for striplines, an analytical approximation has been employed for vias. The models developed have shown close correlation (within+/-1.5 dB) with that of 3D full wave simulation models with frequency ranges of 10 MHz to 20 GHz.

Meeting Name

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

ADS; Circuit Modeling of Via-Stripline Interconnects; HFSS; Parallel Plate Impedance; Stripline Modeling; Via Capacitance; Via Stripline Interconnects

International Standard Book Number (ISBN)

978-153869199-1

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2019

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