Title

The Accuracy of Port Connections between Layers in Printed Circuit Board

Abstract

Port-connected models are widely used in many applications such as printed circuit board models. Much compute time can be saved by using only ports to connect the printed circuit board layers. The accuracy of port connected models is investigated in this paper for the relevant frequency range for PDN applictions. In this short paper, we use a specific three layer structure to study the coupling among closely located ports which connect the two layers.

Meeting Name

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 (2017: Oct. 15-18, San Jose, CA)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Electronics packaging; Timing circuits; Frequency ranges; Power distribution modeling; Power integrity; Three-layer structures; Printed circuit boards; Port connections; Power distribution modeling; Power integrity layer analysis

International Standard Book Number (ISBN)

978-1-5386-3631-2

International Standard Serial Number (ISSN)

2165-4115

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2017

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