The Accuracy of Port Connections between Layers in Printed Circuit Board
Abstract
Port-connected models are widely used in many applications such as printed circuit board models. Much compute time can be saved by using only ports to connect the printed circuit board layers. The accuracy of port connected models is investigated in this paper for the relevant frequency range for PDN applictions. In this short paper, we use a specific three layer structure to study the coupling among closely located ports which connect the two layers.
Recommended Citation
S. Bai et al., "The Accuracy of Port Connections between Layers in Printed Circuit Board," Proceedings of the 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (2017, San Jose, CA), Institute of Electrical and Electronics Engineers (IEEE), Oct 2017.
The definitive version is available at https://doi.org/10.1109/EPEPS.2017.8329731
Meeting Name
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 (2017: Oct. 15-18, San Jose, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Electronics packaging; Timing circuits; Frequency ranges; Power distribution modeling; Power integrity; Three-layer structures; Printed circuit boards; Port connections; Power distribution modeling; Power integrity layer analysis
International Standard Book Number (ISBN)
978-1-5386-3631-2
International Standard Serial Number (ISSN)
2165-4115
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Oct 2017
