Title

Mis-Registration of Sliver Type Backdrill Impact in High Speed Signal Propagation

Abstract

Nowadays, plated-through hole (PTH) via structures are extensively used in printed circuit boards (PCBs). As the data rate increases to Gigahertz range, the via stub resonance effect shows up, which will cause signal distortion and lead to signal integrity issue. In this paper, the impact caused by backdrill mis-registration issue is investigated.

Meeting Name

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Busbars; Electromagnetic compatibility; Polychlorinated biphenyls; Scattering parameters; Backdrill; High-speed signals; Plated through hole; Printed circuit board (PCBs); Resonance effect; Signal Integrity; Sliver; Via stub; Printed circuit boards; Mis-registration; PCB; Plated-through hole; S-parameter; Sliver; TDR; Via stub

International Standard Book Number (ISBN)

978-1-5386-6621-0

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Share

 
COinS