Introduction to the Special Issue for the 2017 IEEE International Symposium on EMC+SIPI
Recommended Citation
G. Spadacini and J. Fan, "Introduction to the Special Issue for the 2017 IEEE International Symposium on EMC+SIPI," IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 4, pp. 1036 - 1037, Institute of Electrical and Electronics Engineers (IEEE), Aug 2018.
The definitive version is available at https://doi.org/10.1109/TEMC.2018.2795358
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Electrical engineering; Electromagnetic pulse; Fans; Internet; Paper; Signal interference; Extended versions; Integrated circuit modeling; Peer-review process; Poster presentations; Scientific contributions; Special issues and sections; Technical content; Technical programs; Electromagnetic compatibility
International Standard Serial Number (ISSN)
0018-9375; 1558-187X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2018
