Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications
Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.
B. Zhao et al., "Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications," Proceedings of the 2018 IEEE International Conference on Computational Electromagnetics (2018, Chengdu, China), Institute of Electrical and Electronics Engineers (IEEE), Mar 2018.
The definitive version is available at https://doi.org/10.1109/COMPEM.2018.8496730
2018 IEEE International Conference on Computational Electromagnetics, ICCEM 2018 (2018: Mar. 26-28, Chengdu, China)
Electrical and Computer Engineering
Keywords and Phrases
Computational electromagnetics; Green's function; Losses; Timing circuits; Layered medium; Multilayer dielectrics; Packaging applications; Three dimensional integrated circuits; 3D IC; Green's function; Loss; Multi-layer dielectrics
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Mar 2018