Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications
Abstract
Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.
Recommended Citation
B. Zhao et al., "Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications," Proceedings of the 2018 IEEE International Conference on Computational Electromagnetics (2018, Chengdu, China), Institute of Electrical and Electronics Engineers (IEEE), Mar 2018.
The definitive version is available at https://doi.org/10.1109/COMPEM.2018.8496730
Meeting Name
2018 IEEE International Conference on Computational Electromagnetics, ICCEM 2018 (2018: Mar. 26-28, Chengdu, China)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Computational electromagnetics; Green's function; Losses; Timing circuits; Layered medium; Multilayer dielectrics; Packaging applications; Three dimensional integrated circuits; 3D IC; Green's function; Loss; Multi-layer dielectrics
International Standard Book Number (ISBN)
978-1-5386-1241-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Mar 2018
Comments
This material is based upon work supported by the National Science Foundation under Grant No. 0855878.