Title

Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications

Abstract

Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.

Meeting Name

2018 IEEE International Conference on Computational Electromagnetics, ICCEM 2018 (2018: Mar. 26-28, Chengdu, China)

Department(s)

Electrical and Computer Engineering

Comments

This material is based upon work supported by the National Science Foundation under Grant No. 0855878.

Keywords and Phrases

Computational electromagnetics; Green's function; Losses; Timing circuits; Layered medium; Multilayer dielectrics; Packaging applications; Three dimensional integrated circuits; 3D IC; Green's function; Loss; Multi-layer dielectrics

International Standard Book Number (ISBN)

978-1-5386-1241-5

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Mar 2018

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