Dielectric Dissipation Factor (DF) Extraction based on Differential Measurements and 2-D Cross-Sectional Analysis


Dielectric substrate properties are critical for highspeed circuit design. It is important to accurately characterize material's dielectric constant (DK) and dissipation factor (DF) after multi-layer PCB fabrication. A method using measured S-parameters and stripline cross-section geometry information to extract DF is developed. Unknown contribution of foil surface roughness to the transmission line loss is reduced by taking into account the ratio between the differential and common mode resistances (K). DF is extracted by relating it to the modal attenuation factors, PUL inductances and capacitances, and K. Several examples are provided using full-wave simulation and fabricated PCB, which demonstrate feasibility of the proposed method.

Meeting Name

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)


Electrical and Computer Engineering

Keywords and Phrases

Busbars; Dielectric materials; Electromagnetic compatibility; Extraction; Polychlorinated biphenyls; Printed circuit boards; Scattering parameters; Sensitivity analysis; Cross sectional analysis; Cross-section geometry; Dielectric dissipation factors; Differential measurements; Error sensitivity analysis; Full-wave simulations; Property extractions; Transmission line loss; Surface roughness; Conductor surface roughness; Material property extraction; PCB

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


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© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2018