Title

Analysis of Wireless Power Transfer system design on active silicon interposer for low voltage applications in 3D-IC

Abstract

In this study, a Wireless Power Transfer (WPT) system design on active silicon (Si) interposer for low voltage applications in 3D-IC is proposed. The proposed WPT system includes magnetically coupled coils, a full-bridge rectifier, and a voltage regulator. In order to validate the proposed system, we first design all of the system components. First, we design a three dimensional helix-type transmitter (Tx) coil with the size of 1.6 mm by 1.6 mm on PCB, and a spiral-type receiver (Rx) coil using 3 μm top metal CMOS process with the size of 1.5 mm by 1.5 mm on Si-interposer. Second, a CMOS full-bridge rectifier is designed on the active Si-interposer to convert the AC voltage received from the Tx coil to DC voltage, which will then be fed to the input of the voltage regulator. Third, we design a voltage regulator to deliver 1.5 V DC voltage supply to multiple low voltage devices in 3D-IC. Power transfer efficiency of the coil system, full-bridge rectifier including a filtering capacitor, and voltage regulator is calculated to be 55 %, 69.5 %, and 71 %, respectively from circuit simulations. The simulated whole system efficiency is found to be 27 %.

Meeting Name

23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 (2014: Oct. 26-29, Portland, OR)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Wireless Power Transfer; Magnetic Coupling; Active Silicon Interposer; Voltage Regulator; Full-Bridge Rectifier; CMOS Process; Time Domain Analysis; Power Transfer Efficiency

International Standard Book Number (ISBN)

978-1-4799-3641-0; 978-1-4799-3643-4

International Standard Serial Number (ISSN)

2165-4107; 2165-4115

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2014

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