Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach
A modal approach for parallel plate impedance and equivalent inductance extraction for power integrity analysis including ball grid arrays (BGAs) between two parallel plates is presented. Since the BGAs are placed close to each other, the current flowing through each ball is not uniformly distributed due to the proximity effect. In this paper, a modal-based cavity method is proposed to count for this proximity effect. Analytical solutions for both the parallel plate impedance and the equivalent inductances associated with the BGAs are derived from the modal-based cavity method. The proposed method is validated by finite element method simulations and the application of the proposed method for power distribution network design is demonstrated.
S. Jin et al., "Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach," IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 5, pp. 1481-1490, Institute of Electrical and Electronics Engineers (IEEE), Oct 2018.
The definitive version is available at https://doi.org/10.1109/TEMC.2017.2782713
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
National Science Foundation (U.S.)
Keywords and Phrases
Ball grid arrays; Cavity resonators; Current density; Electric conductors; Electric impedance; Electronics packaging; Extraction; Frequency modulation; Inductance; Semiconductor device testing; Soldered joints; Cavity method; Equivalent inductance; Finite element method simulation; Modal expansion; Parallel plates; Power Distribution Network Design; Power integrity; Proximity effects; Finite element method; Analytical solution; Application-specified integrated circuit (ASIC) package; Ball grid array (BGA); Equivalent ball inductances; Parallel plate impedance
International Standard Serial Number (ISSN)
Article - Journal
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Oct 2018