Noncontact Wideband Current Probes with High Sensitivity and Spatial Resolution for Noise Location on PCB


This paper develops an improved noncontact current probe for locating the noise source to estimate the electromagnetic interference emission on printed circuit board (PCB). The miniature current probe is fabricated in a four-layer PCB with high-performance dielectric RO4003C. The designs of isolated via array and matching via-pad structures are used to optimize the performance of probe. The probe can then be used for wideband electromagnetic compatibility test from 9 kHz to 10 GHz under narrow and complex conditions. The current probe can be sensitive enough to detect the weak current signal as small as -130 dBA and has a spatial resolution of 1 mm. The application of current probe in noise location on PCBs based on measured surface scan method is investigated in this paper. And two near-field measurement results compared with the reference probe are used to illustrate the new features of the probe.


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory


National Natural Science Foundation (China)
Defense Industrial Technology Development Program (China)


This work was supported in part by the National Natural Science Foundation of China under Grant 61427803 and Grant 61271044, and in part by the Defense Industrial Technology Development Program under Grant JCKY2016601B005.

Keywords and Phrases

Electric current measurement; Electromagnetic compatibility (EMC); Electromagnetic pulse; Electromagnetic wave interference; Frequency estimation; Image resolution; Location; Printed circuit boards; Signal interference; Current probe; Frequency measurements; Near-field scanning; Sensitivity; Spatial resolution; Wide-band; Probes; Current measurement; Electromagnetic interference (EMI) estimation; Noise location; Noncontact current probe

International Standard Serial Number (ISSN)

0018-9456; 1557-9662

Document Type

Article - Journal

Document Version


File Type





© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 May 2018