Improved "Root-Omega" Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs

Abstract

Electrical properties of dielectric substrate are critical in designing high-speed products in terms of signal and power integrity. It is important to accurately characterize the dielectric properties to avoid overestimating or underestimating in the design. This paper proposes the improved "Root-Omega" method for extracting dielectric properties from fabricated multilayer printed circuit boards. Based on the electrical properties of fabricated transmission lines, the improved "Root-Omega" method applied to cases with smooth and rough conductors is validated using simulations. Error sensitivity analysis is performed to demonstrate the potential errors in the original "Root-Omega" procedure and the error sensitivity is significantly reduced by the proposed improvements.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Sponsor(s)

National Science Foundation (U.S.)

Comments

This work was supported in part by the National Science Foundation under Grant IIP-1440110.

Keywords and Phrases

Dielectric materials; Dielectric properties; Electric lines; Errors; Multilayers; Product design; Sensitivity analysis; Dielectric substrates; Error sensitivity; Error sensitivity analysis; Multi-layer pcbs; Multilayer printed circuit board; Potential errors; Power integrity; Property extractions; Printed circuit boards; "Root-Omega" method; Conductor roughness; Error sensitivity analysis; Material property extraction for fabricated printed circuit board; Transmission-line based

International Standard Serial Number (ISSN)

0018-9375; 1558-187X

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2017

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