Improved "Root-Omega" Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs
Electrical properties of dielectric substrate are critical in designing high-speed products in terms of signal and power integrity. It is important to accurately characterize the dielectric properties to avoid overestimating or underestimating in the design. This paper proposes the improved "Root-Omega" method for extracting dielectric properties from fabricated multilayer printed circuit boards. Based on the electrical properties of fabricated transmission lines, the improved "Root-Omega" method applied to cases with smooth and rough conductors is validated using simulations. Error sensitivity analysis is performed to demonstrate the potential errors in the original "Root-Omega" procedure and the error sensitivity is significantly reduced by the proposed improvements.
S. Jin et al., "Improved "Root-Omega" Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs," IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 4, pp. 1356-1367, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/TEMC.2017.2679543
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
National Science Foundation (U.S.)
Keywords and Phrases
Dielectric materials; Dielectric properties; Electric lines; Errors; Multilayers; Product design; Sensitivity analysis; Dielectric substrates; Error sensitivity; Error sensitivity analysis; Multi-layer pcbs; Multilayer printed circuit board; Potential errors; Power integrity; Property extractions; Printed circuit boards; "Root-Omega" method; Conductor roughness; Error sensitivity analysis; Material property extraction for fabricated printed circuit board; Transmission-line based
International Standard Serial Number (ISSN)
Article - Journal
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2017