Femtosecond Laser Processing of Transparent Materials for Assembly-Free Fabrication of Photonic Microsensors
Abstract
In this paper, we summarize our recent research progresses on the understanding, design, fabrication, characterization of various photonic sensors for energy, defense, environmental, biomedical and industry applications. Femtosecond laser processing/ablation of various glass materials (fused silica, doped silica, sapphire, etc.) will be discussed towards the goal of one-step fabrication of novel photonic sensors and new enabling photonic devices. A number of new photonic devices and sensors will be presented.
Recommended Citation
L. Yuan et al., "Femtosecond Laser Processing of Transparent Materials for Assembly-Free Fabrication of Photonic Microsensors," Proceedings of SPIE, Laser Applications in Microelectronic and Optoelectronic Manufacturing XXI, vol. 9735, SPIE, Feb 2016.
The definitive version is available at https://doi.org/10.1117/12.2213883
Meeting Name
SPIE LASE (2016: Feb. 15-18, San Francisco, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Characterization; Fabrication; Fused silica; Glass; Laser applications; Manufacture; Microelectronics; Photonic devices; Sapphire; Silica; Ultrashort pulses, Doped silicas; Femtosecond laser micromachining; Femtosecond laser processing; Glass materials; Industry applications; Photonic sensors; Recent researches; Transparent material, Laser materials processing
International Standard Book Number (ISBN)
978-1628419702
International Standard Serial Number (ISSN)
0277-786X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 SPIE, All rights reserved.
Publication Date
01 Feb 2016