Stub Length Prediction for Back-Drilled Vias using a Fast Via Tool


This paper presents a fast via tool to predict the via stub length after back-drilling. The fast via tool is developed associated with the physics based via model and is combined with the calculation of plane impedance and via capacitance block by block. The entire via model is built by connecting those via blocks one after another accordingly. The plane impedance is calculated from an analytical formula and the via capacitance is computed from the point of view of energy by solving the potential distribution on each via block using FEM. Via stub length is predicted with the observation of strong resonant trough on the insertion loss, which can be in single-ended mode or mixed mode. Two cases, one signal via surrounded by eight ground vias and four signal vias surrounded by four ground vias, are used to verify the modelling accuracy of the fast via tool by correlating to the measurements. The third case is about via stub length extraction as well as the sensitivity investigation between the stub length and the resonant frequency.

Meeting Name

IEEE Electrical Design of Advanced Packaging and Systems Symposium (2010: Dec. 7-9, Singapore)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Analytical Formulas; Mixed Mode; Physics-Based; Potential Distributions; Resonant Frequencies; Single-Ended; Capacitance; Natural Frequencies; Packaging; Design; Resonant Frequency; Transmission Line Measurements; Frequency Measurement; Capacitance; Insertion Loss; Electromagnetic Compatibility; Length Measurement; Sensitivity Analysis; Drilling; Electronics Packaging; Finite Element Analysis; Printed Circuits; Ground Vias; Stub Length Prediction; Back-Drilled Vias; Fast Via Tool; Physics Based Via Model; Via Capacitance; FEM; Single-Ended Mode

International Standard Book Number (ISBN)

978-1424490684; 978-1424490707

International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Dec 2010